Microscope image of electromigration-induced hillock and void
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The electromigration effect revisited: non-uniform local tensile stress-driven diffusion
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Hillocks and voids induced by electromigration with high current
PDF] Influence on the Electro-Migration Resistance by Line Width and Average Grain Size along the Longitudinal Direction of Very Narrow Cu Wires
PDF) In-situ scanning electron microscope observation of electromigration-induced void growth in 30 nm ½ pitch Cu interconnect structures
Micromachines, Free Full-Text
PDF) In-situ scanning electron microscope observation of electromigration-induced void growth in 30 nm ½ pitch Cu interconnect structures
A Review of the Study on the Electromigration and Power Electronics
Mitigation of Electromigration in Metal Interconnects via Hexagonal Boron Nitride as an Ångström‐Thin Passivation Layer - Jeong - 2021 - Advanced Electronic Materials - Wiley Online Library
The electromigration effect revisited: non-uniform local tensile stress-driven diffusion
Observation of void formation patterns in SnAg films undergoing electromigration and simulation using random walk methods
Electromigration - an overview
Mitigation of Electromigration in Metal Interconnects via Hexagonal Boron Nitride as an Ångström‐Thin Passivation Layer - Jeong - 2021 - Advanced Electronic Materials - Wiley Online Library
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